본문내용 바로가기

Wearable Device

High-Efficiency, Rapid and Continuous Synthesis of High-Quality Graphene Oxide and Wide Graphene Sheet User Authentication Based On Multiple Biological Data Self-Powered Wireless Communication SoC for Bio-Implants Self-Powered IoT Device Platform Wearable Multimodal UI/UX Heterogeneous Integration Adaptive Machine Learning-Based AI Services
Concept

Economical synthesis of high-quality graphene oxide using recycled waste acid solution with less energy, and rapid synthesis of high-quality wide graphene sheet using rapid thermal chemical vapor deposition (RTCVD)

Main Features

Graphene oxide synthesis

  • Oxygen content in graphene oxide < 40%, size > 1μ㎡, thickness < 10nm, production capacity: 2 tons/month
  • Recovery rate > 95%, synthesis time < 6 hours, reduced water consumption by 90%, waste acid recovery rate > 85%
  • Competing with Angstron Materials’ batch-based graphene oxide manufacturing technology

High-quality, wide graphene production

  • An RTCVD-based, fast 30-inch or wider graphene growth technique
  • High conductivity (200Ω/sq), high permeability (98%) and uniformity (±5%)
  • Expandable up to 400x400㎟
  • Applicable to touch panels, sensors, secondary batteries, display electrodes and barriers
  • Better in oxidization, diffuse reflection and growth process (coating) than its competitors (AgNW, CNT)
Applications

Touch panelSensorSecondary batteryDisplay

Concept

User authentication and security technology for wearable devices using individual-specific biological data (ECG, optical properties of skin, EEG, etc.)

Main Features

A high-precision wearable authentication device based on ECG and skin patterns

  • False rejection rate (FRR) ≤ 2%, false acceptance rate (FAR) ≤ 0.01%

Skin pattern recognition devices and authentication algorithms under development

A platform for auto-control of EEG electrodes and real-time multi-channel EEG signal processing

  • Usable with headset-style wearables
Applications

HealthcareWearable deviceSecurityFintech

Concept

Wearable device platform technology for self-charging/power generation and ultra-low power wireless communication of bio-implants

Main Features

Power management integrated circuit (PMIC) technology for bio-implants and communication technology for the medical implant communication service (MICS) under development

  • A sub-mW charge/discharge system and high-efficiency charger/generator
  • A wireless chipset and ultra-low power wireless transceiver for the MICS band

Competing with energy harvesting-based PMICs including Linear Technology’s LTC3588 and STMicroelectronics’ STV1050

Applications

Wearable deviceMedical useIoT deviceEnvironmental monitoring

Concept

A wireless charging platform which does not require external power by capturing ambient energy to charge devices

  • Energy sources: radio frequency (RF), light, piezoelectricity, spin torque, thermoelectric generator (TEG), electromagnetic (EM) radiation, etc.
Main Features

RF-based µW energy capturing technology

Simultaneous multi-device charging (up to 4 devices) and device-to-device power transfer

  • Non-directional with resonant inductive coupling and dual-band wireless energy transfer
  • Up to 2m magnetic channel communication range, 1.14m dual-mode charging distance, and independent impedance matching
  • Wireless charging technologies for different applications (e.g. µW charging power for tags, W for sensors, and 1KW for mobile use)

Technologies for resonant-type chip commercialization (A4WP standard, 82% reception efficiency), fast charging (WPC standard, 2A) and powerless sensor tag commercialization

Applications

Wearable deviceEnergy harvestingIoT

Concept

New interactive UI using multiple touch/touchless methods to overcome the limitations of touchscreen-based UI/UX of smartwatches, smart bands, and other wearables

Main Features

Machine learning-based gesture recognition

Multisensory integration and interaction

User experience evaluation

Touch/touchless UI

Applications

Wearable device

Concept

A high-density wafer-level three-dimensional integrated circuit (3D IC) packaging technique that uses silicon interposers (SI) and through-silicon via (TSV) technology to stack multiple heterogeneous semiconductor components

Main Features

Short interconnection and highly-integrated IC-embedded silicon interposer technology

Coaxial TSV and integration of high-Q passive elements using embedded IC and redistribution layer (RDL) on both sides of a silicon interposer

A hybrid MMIC at millimeter-wave frequencies using a silicon interposer

Cost reduction and CTE mismatching issues solved using organic substrate-based TSV technology

Applications

Wearable deviceMilitary radar

Concept

Artificial intelligence that uses machine learning to process sounds, images, texts, and other inputs; understand intentions, contexts, and emotions; and personalize them and interact autonomously

Main Features

An integrated framework for the operation of heterogeneous algorithms in a single system

  • A container design that is easy to build, register, and deploy
  • Plug-and-play interface for a container, and component messaging

Artificial intelligence technology

  • Preplanning: communication management model using rule-based reinforcement learning
  • Autonomous visual intelligence: single-inference multi-label image classification

Integration of AI algorithms created in heterogeneous environments, symbolic and machine learning-based inference, and adaptive label creation using preplanning and autonomous visual intelligence

Applications

Wearable deviceAutonomous drivingIntelligent robot