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IT Materials & Components R&D Division

The key to global technology competitiveness is shifting to materials and components with global standardization of assembling·processing technology of end products. The IT Materials & Components R&D Division is developing core technologies that are required in all industries including electronics, telecommunications, energy, and display as the advanced materials and components technology that enables to respond to future industry demand in the 4th industrial revolution era. We have been especially dedicated to research and development of flexible electronic components, RFIC, system packages, next-generation displays along with nano converging technology and convergence·complex technologies for electronic material. As a designated testing institution by Korea Laboratory Accreditation Sheme(KOLAS), we are also developing reliability technique to improve reliability and quality of electronic components, providing systematic support for the testing, evaluation and improvement of product venerability produced by SMEs and business ventures. We promise to create a new market through materials & components development that responds to industry demand.

Jo, Jinwoo, Vice President of IT materials & Components R&D Division

ICT Device/Packaging Research Center

  • Wireless and optical communication components
    (Antenna, RF filter, FEM, RFIC/MMIC, RF modules,etc.)
  • 5G/B5G RF components and wireless platforms
  • RF radar technology
  • Next generation packaging for convergence systems
  • 2.5D/3D heterogeneous integration
  • IT convergence components for Medical/construction/logistics

Electronic Convergence Materials & Device Research Center

  • 3D printing organic/inorganic composite materials for wearable device
  • Inorganic-polymer composite materials and applications
  • Thin film technology and multilayer process for ICT device
  • High performance piezoelectric ceramics and applications
  • Large-scale/fast ALD process and applications
  • High-barrier encapsulation films
  • Synthesis of Large-scale CVD graphene and applications
  • Functional materials and thin film for smart windows
  • Environment-friendly materials & bonding technology
  • Heat-resistance bonding material and process technology for high temperature devices
  • Adhesive and EMC material technology for high heat dissipation

Nano Convergence Technology Research Center

  • Nanocarbon materials and functional composite materials
  • Printed and flexible electronics
  • Graphene materials, devices, processes and applications
  • High performance glass coating and film technology
  • Heating materials, TIM, heat dissipation materials and components
  • Fine dust reduction materials and processes
  • Environment, Safety, Security, Disaster-related technology
  • Ship building and Underwater acoustics
  • Terahertz devices and applications
  • 3D printing (Materials, Equipments, Control & Monitoring and Applications)
  • LED. Micro-LED and optical component technologies and applications

Reliability Research Center

  • Thermal analysis and solutions
  • RF/EMC analysis and solutions
  • Mechanical Stress analysis
  • Power semiconductor lifetime evaluation
  • Reliability prediction (MIL 217+)
  • Reliability testing (KS, MIL, AEC-Q)
  • Accelerated life testing (ALT, HALT)
  • Failure cause analysis (2D, 3D X-ray, SAT)
  • Electron microscopy analysis (SEM, FIB)